Ming-Chi Kuo reports that Apple has once again delayed its plans to use new resin-coated copper (RCC) components in the iPhone. This change, which would save internal space for the iPhone, was originally rumored to occur with the iPhone 16, then delayed to the iPhone 17, and now delayed again.
In his original report last October, Kuo explained that RCC can reduce the thickness of the mainboard (i.e., it can save internal space) and make the drilling process easier because itβs fiberglass-free.
Using RCC in the iPhone, however, has been a challenge for Apple and its suppliers due to concerns about durability and fragility. Thatβs again said to be the reason for this latest delay.
βDue to the inability to meet Appleβs high-quality requirements, the new iPhone 17 in 2025 will not use RCC as the PCB motherboard material,β Kuo wrote in a brief update on social media today.
If Apple eventually switches the iPhoneβs mainboard to resin-coated copper, itβs not a change anyone would realize in and of itself. Instead, it would free up more internal space for the iPhoneβs design. Apple could then choose to make iPhones thinner or find other ways to use that added free space.
Kuoβs report today doesnβt detail whether we might see this change with the iPhone 18 in 2026 or if weβre looking at a longer-term delay.
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